Fatigue life predictions of solder joint under thermal cyclic loading

The main failure of the solder joint in the electronic components is related with the thermal cyclic loading and the coefficient of thermal expansion (CTE) mismatched between the chip and the substrate. Therefore, this study will focus on the reliability assessed by using finite element analysis to simulate the PBGA-256 slice models with both lead-free (95.5Sn-3.9Ag-0.6Cu) and tin-lead (62Sn-36Pb-2Ag) solder joints under thermal cyclic loading. The fatigue life prediction models based on the accumulated creep strain and the accumulated creep strain energy density for lead-free and tin-lead solder joints are to use the Schubert´s equation and Dudek´s equation to estimate the fatigue lives of the solder joint in the PBGA-256 package.