High speed testing method on leaf-free solder

The most frequent failure of movable electronic products is an accidental drop to the ground. Therefore the effect of impact on electronic package is very important. This paper aims to study the mechanical behavior of lead-free solder joint under high speed impact. A series of experiments is conducted to study the effect of impact velocity and room temperature (R.T.) aging. All experiments were performed by Instron micro-impact system. The results presented that the impact velocity and R.T. aging have significant effect on the occur rate of failure mode. Differential failure modes have different effect by impact velocity and R.T. aging. The tests results show that the peak load is increased but the energy absorption is reduced with increasing impact velocity when failure mode is on solder ball. The impact velocity not significant affect on failure mode on interface fracture. The results reported in this paper could clearly identify the high speed ball shearing test is useful to measure impact loading capacity as well as provide similar failure modes as drop tests.