DocumentCode :
2808554
Title :
Theoretical and experimental characterization of process-induced thermal-mechanical behaviors of an ultra-thin chip-on-film assembly
Author :
Cheng, Hsien-Chie ; Ho, Hsiang-Chung ; Lu, Su-Tsai
Author_Institution :
Feng Chia Univ., Taichung
fYear :
2007
fDate :
1-3 Oct. 2007
Firstpage :
318
Lastpage :
321
Abstract :
In this study, an advanced flexible electronics technology, termed as the ultra-thin chip-on-film (UTCOF) technology, is introduced. The technology implements an epoxy-based anisotropic conductive film (ACF), a composite materials composed of an adhesive polymer resin and conductive particles of metal-coated polymer particles, to form fine-pitch and reliable interconnects of IC bumps on flex substrates. Basically, yield and reliability that determine the feasibility of any proposed novel technology are two of the most critical and essential issues. Prior to attempting to better the reliability of the technology, it is necessary and essential to well comprehend its thermal-mechanical behaviors. Hence, the main objective of the study is to investigate the process-induced thermal- mechanical behaviors of the UTCOF technology during the ACF bonding process. Furthermore, to undertake the thermal-mechanical modeling, a process-dependent simulation methodology that integrates both thermal and thermal-mechanical finite element (FE) analyses together with a "death-birth" meshing scheme is proposed. The validity of the modeled results is verified through a micro thermocouple experiment, a warpage measurement using a Micro Figure Measurement Instrument and laser scanner.
Keywords :
adhesives; composite materials; finite element analysis; flexible electronics; optical scanners; polymer films; resins; adhesive polymer resin; composite materials; conductive particles; epoxy-based anisotropic conductive film; finite element analyses; laser scanner; metal-coated polymer particles; microfigure measurement instrument; process-induced thermal-mechanical behaviors; thermal-mechanical behaviors; ultrathin chip-on-film assembly; warpage measurement; Analytical models; Anisotropic conductive films; Assembly; Bonding processes; Composite materials; Flexible electronics; Materials reliability; Polymer films; Resins; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-1636-3
Electronic_ISBN :
978-1-4244-1637-0
Type :
conf
DOI :
10.1109/IMPACT.2007.4433626
Filename :
4433626
Link To Document :
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