DocumentCode
2808881
Title
The influence of moisture absorption on the electrical breakdown and dielectric behaviour of SRBP
Author
Brown, M.A. ; Champion, J.V. ; Dodd, S.J. ; Ahern, B. ; Pettinger, J. ; Waite, F.
Author_Institution
Southampton Univ., UK
fYear
2005
fDate
16-19 Oct. 2005
Firstpage
87
Lastpage
90
Abstract
The electrical breakdown and dielectric characteristics of synthetic resin bonded paper (SRBP) are studied as a function of moisture absorption. The breakdown tests, (at 50 Hz) showed a significant (several orders of magnitude) deterioration in the breakdown performance at moisture uptakes greater than 4% of the sample mass. This change in electrical performance was confirmed by dielectric spectroscopy of SRBP samples. The spectra shows an exponential increase in both the permittivity and the dielectric loss as a function of increasing moisture uptake. Dielectric spectroscopy conducted on the paper alone confirms that the changes in the SRBP composite, are dominated by the dielectric characteristics of the paper layers. The spectra of the composite is dominated by an interfacial polarisation effect once moisture is absorbed into the material, and consequently the thin resin layers are subjected to higher electric fields as moisture increases. It is this change in the electrical stress distribution within the composite that leads to deterioration in the electrical breakdown behaviour of SRBP.
Keywords
absorption; dielectric polarisation; electric breakdown; permittivity; resins; dielectric loss; dielectric spectroscopy; electric field; electrical breakdown; electrical stress distribution; interfacial polarisation; permittivity; synthetic resin bonded paper; Absorption; Bonding; Dielectric breakdown; Dielectric losses; Electric breakdown; Electrochemical impedance spectroscopy; Moisture; Permittivity; Resins; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 2005. CEIDP '05. 2005 Annual Report Conference on
Print_ISBN
0-7803-9257-4
Type
conf
DOI
10.1109/CEIDP.2005.1560627
Filename
1560627
Link To Document