DocumentCode :
2809030
Title :
A study on properties of SAW and the magnetic thin-film bond
Author :
Choi, Jeong-Sik ; Moon, Jong-Dae ; So, Cheol-Ho ; Cha, In Su
Author_Institution :
Dept. of Electr. & Opt. Electron. Eng., Dongshin Univ., Naju, South Korea
fYear :
2003
fDate :
28-30 May 2003
Firstpage :
179
Lastpage :
180
Abstract :
We manufactured photo mask to make surface acoustic wave (SAW) filter that use special quality of these LiNbO3 piezoelectric material (100). To make IDT electrode, we evaporated aluminum about 6000 Å, and achieved lithography process by using e-beam evaporator. Filament evaporation method was selected to evaporate nickel magnetic thin film between Tx-IDT terminal and Rx-IDT terminal. Thickness of evaporated nickel was about 4000 Å. Width of IDT electrode that is used here are 50 μm and space between IDT electrodes is 50 μm. Metal piece is 8 pair, the length of metal piece is 8 mm and the whole size is 52 mm×24 mm. The calculated SAW is 200 μm. It is confirmed that manufactured LiNbO3-IDT´s center frequency is 18.1 MHz. The average velocity of SAW, that propagates LiNbO3-IDT´s Tx-IDT and Rx-IDT both terminal, measured v=3888±2.565m/s. And SAW´s average velocity, that propagates LiNbO3-Ni-IDT´s Tx-IDT and Rx-IDT both terminal, measured v=3827±1.474m/s. While SAW passing magnetic thin films, its velocity decreased about 1.5% (61m/s).
Keywords :
acoustic wave velocity; interdigital transducers; lithium compounds; lithography; magnetic thin films; masks; nickel; piezoelectric materials; surface acoustic wave filters; 18.1 MHz; 3827 m/s; 3888 m/s; 4000 Å; 50 micron; 61 m/s; 8 mm; IDT electrode; LiNbO3; Ni; SAW; aluminum evaporation; e-beam evaporation; filament evaporation; lithography; magnetic thin film bond; nickel magnetic thin film; photomask; piezoelectric material; surface acoustic wave filter; Acoustic waves; Bonding; Electrodes; Magnetic films; Magnetic properties; Magnetic separation; Manufacturing; Nickel; Surface acoustic waves; Velocity measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Vacuum Electronics, 2003 4th IEEE International Conference on
Print_ISBN :
0-7803-7699-4
Type :
conf
DOI :
10.1109/IVEC.2003.1286223
Filename :
1286223
Link To Document :
بازگشت