The design of a knowledge-based system for electronic package design

Author

Aakalu, N. ; Barnes, J. ; Beard, R. ; Christiansen, G. ; Iskander, M. ; Kamerath, E. ; Vuu, L.

Author_Institution

Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA

fYear

1991

fDate

24-28 June 1991

Firstpage

480

Abstract

The development of an integrated CAD (computer-aided design) resource of design tools and databases which provides a valuable tool in the design of electronic packages is described. Results of various test cases are presented and used to evaluate the performance of the developed knowledge-based system and identify areas of needed improvements. The following issues which are important in electronic package design are discussed: electrical characterization, mechanical stress, thermal distribution, and wireability analysis.<>

Keywords

circuit CAD; knowledge based systems; stress analysis; thermal analysis; computer-aided design; databases; design tools; electrical characterization; electronic package design; knowledge-based system; mechanical stress; test cases; thermal distribution; wireability analysis; Databases; Design automation; Design engineering; Electronic packaging thermal management; Electronics packaging; Expert systems; Integrated circuit packaging; Knowledge based systems; Software packages; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 1991. AP-S. Digest

Conference_Location

London, Ontario, Canada

Print_ISBN

0-7803-0144-7

Type

conf

DOI

10.1109/APS.1991.174879

Filename

174879