DocumentCode
2809681
Title
A spot-defect to fault collapsing technique
Author
Di, Chennian ; De Gyvez, Jose Pineda
Author_Institution
Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
fYear
1990
fDate
12-14 Aug 1990
Firstpage
580
Abstract
A new technique is presented that is capable of collapsing defects to circuit faults by establishing a simple probabilistic model between them. This way of modeling supplies accurate results for ranking the failure probability of nodes and the probability of occurrence of faults. Since it is independent of the multilayer critical area extraction, the collapsing and its related applications can be done effectively in a rather short CPU time. By applying this technique, the likelihood of occurrence of faults, induced by defects, can be ranked accurately according to the conditions prevailing in the manufacturing line. The derivation of the weighted spectrums of nodes, or partial faults, can further be used for manufacturing debugging. The results of the analysis show that conventional testing methods concentrating on single stuck-at faults are insufficient and that, in particular, multiple faults need more careful treatment
Keywords
failure analysis; fault location; production testing; CPU time; failure probability; fault collapsing technique; manufacturing debugging; manufacturing line; multilayer critical area extraction; multiple faults; probabilistic model; Bridge circuits; Circuit faults; Circuit synthesis; Circuit testing; Fault detection; Integrated circuit testing; Manufacturing; Nonhomogeneous media; Performance analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 1990., Proceedings of the 33rd Midwest Symposium on
Conference_Location
Calgary, Alta.
Print_ISBN
0-7803-0081-5
Type
conf
DOI
10.1109/MWSCAS.1990.140785
Filename
140785
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