DocumentCode
2810902
Title
Analysis of ground bond wire arrays for RFICs
Author
Patterson, H.
Author_Institution
Motorola Inc., Tempe, AZ, USA
fYear
1997
fDate
10-10 June 1997
Firstpage
237
Lastpage
240
Abstract
This paper outlines a method for rapid computation of the inductance of arrays of ground bond wires for RFICs, thus saving a designer considerable time over using inaccurate empirical equations or slowly converging electromagnetic simulators. Results comparable in accuracy to a fully detailed PEEC electromagnetic simulation are shown.
Keywords
arrays; inductance; integrated circuit modelling; integrated circuit technology; lead bonding; PEEC electromagnetic simulation; RFIC; design; ground bond wire array; inductance; Bonding; Equations; Image segmentation; Inductance; Length measurement; Microscopy; Radiofrequency integrated circuits; Skin effect; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio Frequency Integrated Circuits (RFIC) Symposium, 1997., IEEE
Conference_Location
Denver, CO, USA
Print_ISBN
0-7803-4063-9
Type
conf
DOI
10.1109/RFIC.1997.598796
Filename
598796
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