DocumentCode
2811473
Title
The optimised design and characterization of 1200 V / 2.0 mΩ cm2 4H-SiC V-groove trench MOSFETs
Author
Uchida, Kosuke ; Saitoh, Yu. ; Hiyoshi, Toru ; Masuda, Takeyoshi ; Wada, Keiji ; Tamaso, Hideto ; Hatayama, Tomoaki ; Hiratsuka, Kenji ; Tsuno, Takashi ; Furumai, Masaki ; Mikamura, Yasuki
Author_Institution
Power Device Dev. Div., Sumitomo Electr. Ind., Ltd., Osaka, Japan
fYear
2015
fDate
10-14 May 2015
Firstpage
85
Lastpage
88
Abstract
V-groove trench MOSFETs with the 4H-SiC{0-33-8} face as the trench sidewall for the channel region have been investigated. The on-resistance and breakdown voltage strongly depend on the aperture ratio of the buried p+ regions. The VMOSFETs with the buried p+ regions of 71% on a 6-inch wafer exhibited a low specific on-resistance of 2.0 mΩ cm2 with 1200 V blocking voltage. The threshold voltage is 2.3 V at 175°C, which shows the VMOSFETs have tolerability for an erroneous ignition under high temperature. The switching capability showed low switching losses over DMOSFETs on 4° off 4H-SiC(0001) face and normal operation under fast switching repetitive test (40 Vns-1). The stability of the threshold voltage was demonstrated by HTGB tests.
Keywords
isolation technology; power MOSFET; semiconductor device breakdown; semiconductor device testing; silicon compounds; wide band gap semiconductors; SiC; V-groove trench MOSFET; breakdown voltage; on-resistance; threshold voltage stability; trench sidewall; voltage 1200 V; Apertures; Electric fields; Logic gates; MOSFET; Silicon carbide; Switches; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices & IC's (ISPSD), 2015 IEEE 27th International Symposium on
Conference_Location
Hong Kong
ISSN
1943-653X
Print_ISBN
978-1-4799-6259-4
Type
conf
DOI
10.1109/ISPSD.2015.7123395
Filename
7123395
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