DocumentCode
2811528
Title
Channel coupling imposed tradeoffs on hot carrier degradation and single transistor latch-up in SOI MOSFETs
Author
Duan, Franklin L. ; Ioannou, Dimitris E. ; Jenkins, William C. ; Hughes, Harold L. ; Liu, Mike S T
Author_Institution
Dept. of Electr. & Comput. Eng., George Mason Univ., Fairfax, VA, USA
fYear
1998
fDate
March 31 1998-April 2 1998
Firstpage
194
Lastpage
202
Abstract
Carrier generation by impact ionization in SOI MOSFETs as a function of the strength of channel coupling, adjusted by varying the back gate bias or the silicon film thickness, was extensively studied by extensive PISCES numerical simulations. The results show that stronger front/back channel coupling results in lower carrier generation, and consequently, lower hot carrier degradation. Experimental measurements of the substrate current and hot carrier device degradation verified these results. At the same time, however, the stronger channel coupling results in a lower value for the single-transistor latch-up voltage V/sub DLU/. The above observations mean that there is a trade-off between hot carrier degradation and single transistor latch-up voltage in SOI MOSFETs.
Keywords
MOSFET; electronic engineering computing; hot carriers; impact ionisation; numerical analysis; semiconductor device models; semiconductor device reliability; semiconductor device testing; silicon-on-insulator; software tools; PISCES numerical simulations; SOI MOSFETs; Si-SiO/sub 2/; back gate bias; carrier generation; channel coupling; channel coupling imposed trade-offs; front/back channel coupling; hot carrier degradation; hot carrier device degradation; impact ionization; silicon film thickness; single transistor latch-up; single-transistor latch-up voltage; substrate current; Current measurement; Degradation; Hot carriers; Impact ionization; MOSFETs; Numerical simulation; Semiconductor films; Silicon; Substrates; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 1998. 36th Annual. 1998 IEEE International
Conference_Location
Reno, NV, USA
Print_ISBN
0-7803-4400-6
Type
conf
DOI
10.1109/RELPHY.1998.670542
Filename
670542
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