DocumentCode :
2811820
Title :
A proposal of LDMOS using Deep Trench poly field plate
Author :
Joowon Park ; Kwangsik Ko ; Jina Eum ; Kuemju Lee ; Jungsu Jin ; Yeounsoo Kim ; Seonghoe Jeong ; Sanghyun Lee ; Jaehee Lee ; Inwook Cho
Author_Institution :
Technol. Dev. Team, SK Hynix Inc., Cheongju, South Korea
fYear :
2015
fDate :
10-14 May 2015
Firstpage :
149
Lastpage :
152
Abstract :
In this paper, we developed Deep Trench structure of LDMOS instead of STI in conventional one, with 0.18um 60V BCD process. By forming vertical drift region using Deep Trench, we achieved lower Ron.sp from cell pitch shrink while BVdss does not change. As a result we achieved 76V BVdss and 49.3 mohm*mm2 Ron.sp of low side 60V rated LDNMOS.
Keywords :
BIMOS integrated circuits; BCD process; BVdss; LDMOS; LDNMOS; STI; cell pitch shrink; deep trench poly field plate; deep trench structure; size 0.18 mum; voltage 60 V; voltage 76 V; Electric fields; Implants; Junctions; Layout; Logic gates; Plugs; Resistance; DTFP; LDMOS; vertical drift region;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2015 IEEE 27th International Symposium on
Conference_Location :
Hong Kong
ISSN :
1943-653X
Print_ISBN :
978-1-4799-6259-4
Type :
conf
DOI :
10.1109/ISPSD.2015.7123411
Filename :
7123411
Link To Document :
بازگشت