Title :
LTCC 3D integration platform for microwave and millimeter wave modules
Author :
Vaha-Heikkila, T. ; Lahti, M.
Author_Institution :
VTT Tech. Res. Centre of Finland, Espoo, Finland
Abstract :
This paper introduces Low Temperature Co-Fired Ceramics (LTCC) technology platform which is an integration platform for multi chip modules. LTCC platform is also well suited for the realization of antenna arrays, filters and other passives from RF to millimeter wave frequencies. Examples of realized components and modules are presented in the paper.
Keywords :
antenna accessories; ceramic packaging; microwave antenna arrays; millimetre wave antenna arrays; millimetre wave integrated circuits; three-dimensional integrated circuits; LTCC 3D integration platform; RF; antenna arrays; low temperature cofired ceramics technology; microwave modules; millimeter wave frequencies; millimeter wave modules; multichip modules; Decision support systems; Radio frequency; 3D integration; LTCC; System-in-package; antennas; filters; modules;
Conference_Titel :
Radio-Frequency Integration Technology (RFIT), 2012 IEEE International Symposium on
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-2303-1
DOI :
10.1109/RFIT.2012.6401625
