DocumentCode :
2813165
Title :
Accelerated temperature cycle test and Coffin-Manson model for electronic packaging
Author :
Cui, Helen
Author_Institution :
RF Micro Devices, Greensboro, NC, USA
fYear :
2005
fDate :
Jan. 24-27, 2005
Firstpage :
556
Lastpage :
560
Keywords :
Weibull distribution; cracks; electronics packaging; failure analysis; life testing; reliability; stress analysis; Coffin-Manson model; Weibull analysis; accelerated reliability testing; accelerated temperature cycle test; activation energy; electronic packaging; failure analysis; mechanical cracks; product reliability; root cause failure mechanism; solder fatigue; stress level; Consumer electronics; Data analysis; Electronic equipment testing; Electronics packaging; Failure analysis; Fatigue; Life estimation; Radio frequency; Stress; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability and Maintainability Symposium, 2005. Proceedings. Annual
ISSN :
0149-144X
Print_ISBN :
0-7803-8824-0
Type :
conf
DOI :
10.1109/RAMS.2005.1408421
Filename :
1408421
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2813165
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