• DocumentCode
    2813259
  • Title

    Voltage scaling and temperature effects on drain leakage current degradation in a hot carrier stressed n-MOSFET

  • Author

    Wang, Tahui ; Hsu, C.F. ; Chiang, L.P. ; Zous, N.K. ; Chao, T.S. ; Chang, C.Y.

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    1998
  • fDate
    March 31 1998-April 2 1998
  • Firstpage
    209
  • Lastpage
    212
  • Abstract
    Drain leakage current degradation at zero V/sub gs/ in a hot carrier stressed n-MOSFET is measured and modeled. The dependences of drain leakage current on supply voltage and temperature are characterized. In modeling, various drain leakage current mechanisms including drain-to-source subthreshold leakage current, band-to-band tunneling current and interface trap assisted leakage current are taken into account. The results show that interface trap induced leakage current appears to be a dominant drain leakage mechanism as the supply voltage is scaled below 3.0 V. Drain leakage current degradation by orders of magnitude has been observed due to hot carrier stress.
  • Keywords
    MOSFET; electron traps; hole traps; hot carriers; interface states; leakage currents; semiconductor device models; semiconductor device testing; tunnelling; 3 V; band-to-band tunneling current; dominant drain leakage mechanism; drain leakage current; drain leakage current degradation; drain leakage current mechanisms; drain-to-source subthreshold leakage current; hot carrier stress; hot carrier stressed n-MOSFET; interface trap assisted leakage current; interface trap induced leakage current; modeling; supply voltage; supply voltage scaling; temperature effects; voltage scaling effects; Current measurement; Current supplies; Degradation; Hot carriers; Leakage current; MOSFET circuits; Stress measurement; Subthreshold current; Temperature dependence; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 1998. 36th Annual. 1998 IEEE International
  • Conference_Location
    Reno, NV, USA
  • Print_ISBN
    0-7803-4400-6
  • Type

    conf

  • DOI
    10.1109/RELPHY.1998.670552
  • Filename
    670552