• DocumentCode
    2813505
  • Title

    Balancing soft error coverage with lifetime reliability in redundantly multithreaded processors

  • Author

    Siddiqua, Taniya ; Gurumurthi, Sudhanva

  • Author_Institution
    Dept. of Comput. Sci., Univ. of Virginia, Charlottesville, VA, USA
  • fYear
    2009
  • fDate
    21-23 Sept. 2009
  • Firstpage
    1
  • Lastpage
    12
  • Abstract
    Silicon reliability is a key challenge facing the microprocessor industry. Processors need to be designed such that they are resilient against both soft errors and lifetime reliability phenomena. However, techniques developed to address one class of reliability problems may impact other aspects of silicon reliability. In this paper, we show that redundant multi-threading (RMT), which provides soft error protection, exacerbates lifetime reliability. We then explore two different architectural approaches to tackle this problem, namely, dynamic voltage scaling (DVS) and partial RMT. We show that each approach has certain strengths and weaknesses with respect to performance, soft error coverage, and lifetime reliability. We then propose and evaluate a hybrid approach that combines DVS and partial RMT. We show that this approach provides better improvement in lifetime reliability than DVS or partial RMT alone, buys back a significant amount of performance that is lost due to DVS, and provides nearly complete soft error coverage.
  • Keywords
    microprocessor chips; multi-threading; power aware computing; redundancy; dynamic voltage scaling; lifetime reliability; microprocessor industry; redundant multithreading; redundantly multithreaded processors; silicon reliability; soft error coverage; soft error protection; Computer errors; Computer industry; Computer science; Dynamic voltage scaling; Logic arrays; Microprocessors; Protection; Silicon; Voltage control; Yarn;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Modeling, Analysis & Simulation of Computer and Telecommunication Systems, 2009. MASCOTS '09. IEEE International Symposium on
  • Conference_Location
    London
  • ISSN
    1526-7539
  • Print_ISBN
    978-1-4244-4927-9
  • Electronic_ISBN
    1526-7539
  • Type

    conf

  • DOI
    10.1109/MASCOT.2009.5363142
  • Filename
    5363142