Title :
Novel approach to partial discharge signals modeling in dielectric insulation void using extension of lumped capacitance model
Author :
Chia, P.Y. ; Liew, A.C.
Author_Institution :
Dept. of Electr. Eng., Nat. Univ. of Singapore, Singapore
Abstract :
Using a lumped capacitance circuit model simulated under the Electromagnetic Transient for DC (EMTDC) program, waveforms of the Whitehead equivalent void model are generated and analyzed. Type of discharge varies within a void and is not readily known due to the uncertainty in the parameters. This paper attempts a model to segregate types of partial discharge (PD) within dielectric insulation on the signal waveform level. The EMTDC program provided a platform to trace the transient stressing of various parts within a void. The uncertain mechanism of discharge signal manifestation, localized at insulation imperfection area, of polymeric insulation is represented by capacitors with variable breakdown conditions. Voids with known sizes are modeled and simulations are carried out to see the transient behavior of breakdown. The modified model helps to visualize the kind of PD activity that goes on within the dielectric occluded void
Keywords :
EMTP; capacitance; insulation; partial discharge measurement; signal processing; voids (solid); EMTDC program; Electromagnetic Transient for DC program; Whitehead equivalent void model; dielectric insulation; dielectric insulation void; dielectric occluded void; discharge signal manifestation; insulation imperfection area; lumped capacitance model extension; partial discharge segregation; partial discharge signals modeling; polymeric insulation; signal waveform level; uncertain mechanism; Analytical models; Capacitance; Circuit simulation; DC generators; Dielectrics and electrical insulation; EMTDC; Electric breakdown; Electromagnetic modeling; Partial discharges; Plastic insulation;
Conference_Titel :
Power System Technology, 2000. Proceedings. PowerCon 2000. International Conference on
Conference_Location :
Perth, WA
Print_ISBN :
0-7803-6338-8
DOI :
10.1109/ICPST.2000.898141