Working with nine different foundries

Author

Stoneham, E.B. ; O´Sullivan, P.A.J. ; Mitchell, S.W. ; Podell, A.F.

Author_Institution

Pacific Monolithics, Sunnyvale, CA, USA

fYear

1990

fDate

7-10 Oct. 1990

Firstpage

11

Lastpage

14

Abstract

Experience in channeling MMIC designs through processes in several foundries has led the authors to insights into impediments faced by the GaAs industry. Problems affecting chip performance have been due primarily to variables not subject to foundry specifications. These problems include backgating, substrate oscillations, photosensitivity, large-signal discrepancies, and the post-process problems that follow front-side processing. Barring these problems, the cost of chips for high-volume analog applications is most strongly affected by design rules and specification tolerances.<>

Keywords

III-V semiconductors; MMIC; gallium arsenide; integrated circuit technology; semiconductor technology; GaAs industry; MMIC designs; backgating; cost of chips; design rules; front-side processing; high-volume analog applications; impediments; large-signal discrepancies; photosensitivity; post-process problems; semiconductors; several foundries; specification tolerances; substrate oscillations; Capacitance; Costs; FETs; Fabrication; Foundries; Gallium arsenide; Impedance; MODFET circuits; Phase change materials; Process design;

fLanguage

English

Publisher

ieee

Conference_Titel

Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1990. Technical Digest 1990., 12th Annual

Conference_Location

New Orleans, LA, USA

Type

conf

DOI

10.1109/GAAS.1990.175434

Filename

175434