• DocumentCode
    281609
  • Title

    Technology spectrum for automotive intelligent power

  • Author

    Colman, D. ; Marshall, A.

  • Author_Institution
    Texas Instrum. Ltd., Bedford, UK
  • fYear
    1989
  • fDate
    32574
  • Firstpage
    42491
  • Lastpage
    42494
  • Abstract
    The automotive intelligent power market is diverse with load currents varying from 0.1 to 30 A and with requirements for high side drivers, low side drivers and bridges. To meet the needs of these applications TI (Texas Instruments) has at its disposal a range of technologies, namely, bipolar IC, BIDFET, multiepi and multidie. The relative features of each of these technologies is discussed showing how each one has its particular niche and how together they form a wide capability to fulfil the needs of the automotive market
  • Keywords
    automotive electronics; computerised instrumentation; hybrid integrated circuits; integrated circuit technology; monolithic integrated circuits; power integrated circuits; 0.1 to 30 A; BIDFET; Texas Instruments; automotive intelligent power; bipolar IC; bridges; high side drivers; low side drivers; multidie; multiepi; power IC technology;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Power Integrated Circuits, IEE Colloquium on
  • Conference_Location
    London
  • Type

    conf

  • Filename
    197979