Title :
Ultrahigh-speed HEMT LSI technology
Author :
Abe, M. ; Mimura, T.
Author_Institution :
Fujitsu Lab. Ltd., Atsugi, Japan
Abstract :
The current status of HEMT (high-electron mobility transistor) technology for high-performance VLSI is presented, focusing on device structure in the submicrometer-dimensional range, a self-aligned HEMT LSI processing, and HEMT LSIs implemented in a supercomputer system. The 1.1 K gate bus driver logic LSI has been developed to demonstrate the high-speed data transfer in a highly parallel processing system at room temperature, operating at 10.92 GFLOPS speed. A cryogenic 3.3 K gate random number generator logic LSI with maximum clock frequency of 1.6 GHz has also been developed to demonstrate the high-clock-rate system operations at liquid nitrogen temperature. With submicrometer gates, as well as advanced materials technologies, a HEMT 64 kb static RAM with subnanosecond access operation and a 10 K-gate logic LSI with subhundred-picosecond logic delays are possible.<>
Keywords :
SRAM chips; VLSI; field effect integrated circuits; high electron mobility transistors; integrated logic circuits; random number generation; 10.92 GFLOPS; HEMT; bus driver logic; clock frequency; high-performance VLSI; liquid nitrogen temperature; parallel processing; random number generator logic; static RAM; subhundred-picosecond logic delays; submicrometer-dimensional range; subnanosecond access operation; supercomputer system; Driver circuits; HEMTs; Large scale integration; Logic devices; Logic gates; MODFETs; Parallel processing; Supercomputers; Temperature; Very large scale integration;
Conference_Titel :
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1990. Technical Digest 1990., 12th Annual
Conference_Location :
New Orleans, LA, USA
DOI :
10.1109/GAAS.1990.175467