• DocumentCode
    2816176
  • Title

    Intrinsic temperature compensation of aluminum nitride Lamb wave resonators for multiple-frequency references

  • Author

    Kuypers, Jan H. ; Lin, Chih-Ming ; Vigevani, Gabriele ; Pisano, Albert P.

  • Author_Institution
    Dept. of Mech. Eng., Univ. of California at Berkeley, Berkeley, CA
  • fYear
    2008
  • fDate
    19-21 May 2008
  • Firstpage
    240
  • Lastpage
    249
  • Abstract
    In this paper we present the temperature compensation of aluminum nitride (AlN) Lamb wave resonators for a future application to XOs and TCXOs for a frequency ranging from 100 MHz to 1000 MHz. The temperature coefficient of frequency (TCF) for the lowest symmetric Lamb wave mode S0 for AlN plates with h/lambda<0.3 is found to be around -30 ppm/K. A zero TCF resonator is obtained by adding a compensating silicon dioxide layer. The low dispersion of the phase velocity for the S0-mode propagating in thin AlN plates reduces not only the fabrication tolerances towards thickness variations of the AlN layer, but also enables resonators operating over a wide frequency range, i.e. from 100 MHz to 1000 MHz, based on two absolute film thicknesses for AlN and SiO2 achieving near zero TCF over the entire frequency range. The acoustic properties and different layer configurations of zero TCF Lamb wave devices are discussed in detail.
  • Keywords
    surface acoustic wave resonators; aluminum nitride; aluminum nitride Lamb wave resonators; fabrication tolerances; frequency 100 MHz to 1000 MHz; intrinsic temperature compensation; multiple-frequency references; silicon dioxide layer; temperature coefficient of frequency; Acoustic waves; Aluminum nitride; Circuits; Frequency; Oscillators; Phase noise; Silicon; Temperature distribution; Temperature sensors; Wireless communication; Aluminum Nitride; Compensation; Frequency Reference; Lamb Waves; Temperature; Zero TCF;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frequency Control Symposium, 2008 IEEE International
  • Conference_Location
    Honolulu, HI
  • ISSN
    1075-6787
  • Print_ISBN
    978-1-4244-1794-0
  • Electronic_ISBN
    1075-6787
  • Type

    conf

  • DOI
    10.1109/FREQ.2008.4622998
  • Filename
    4622998