Semiconductor devices drive environmentally conscious product (ECP) goals

Semiconductor technology advances not only drive performance aspects but contribute significantly towards promoting environmentally conscious product (ECP) goals by reducing power requirements and materials for the same function through scaling. As the market drives towards smaller and portable hand-held devices, battery life becomes significant. Several new technologies are discussed which have provided the leadership in manufacturing for IBM microchips while significantly enhancing energy usage material requirements. Copper technology has become the conductor of choice allowing higher speeds through smaller dimensions. Aluminum is not able to keep up when the transistors were made faster and packed closer together thus causing the interconnection to be the gate. Resistance and inductance sap semiconductor speed and power, which has now been overcome through the use of copper technology. Silicon-on-insulator (SOI) alters the transistor design, enhancing them to run faster and use less power. The SOI process protects the millions of tiny transistors on a chip with a “blanket” of insulation, reducing harmful electrical effects that sap energy. If performance levels are held constant, SOI chips can require as little as 1/3 the power of today´s microchips. SiGe material enhancements offer even further power and material reductions by making it possible to pack more transistors onto a single chip. This technology enhances performance while addressing low-power needs of wireless products, the network access appliance market, as well as the growing segments of the networked world with requirements for high speed routers and switches. This new market outlook demand for more portable devices and the subsequent battery life makes it a major concern to maximize the life of batteries (reducing power requirements) in order to support environmentally conscious goals of energy consumption, materials and disposal concerns