DocumentCode
2816265
Title
Carbon dioxide-based supercritical fluids as IC manufacturing solvents
Author
Rubin, J.B. ; Davenhall, L.B. ; Taylor, C.M.V. ; Sivils, L. Dale ; Pierce, T. ; Tiefert, Karl
Author_Institution
Phys. Org. Chem. Group, Los Alamos Nat. Lab., NM, USA
fYear
1999
fDate
1999
Firstpage
13
Lastpage
20
Abstract
The production of integrated circuits (ICs) involves a number of discrete steps which utilize hazardous or regulated solvents and generate large waste streams. ES&H considerations associated with these chemicals have prompted a search for alternative, more environmentally benign solvent systems. Here, the authors describe how an emerging technology for conventional solvent replacement is the use of supercritical fluids based on carbon dioxide (CO2). Research work, conducted at Los Alamos in conjunction with the Hewlett-Packard Company, has lead to the development of a CO2-based supercritical fluid treatment system for the stripping of hard-baked photoresists. This treatment system, known as supercritical CO2 resist remover, or SCORR, uses a two-component solvent composed of a nonhazardous, nonregulated compound, dissolved in supercritical CO2. The solvent/treatment system has been successfully tested on metallized Si wafers coated with negative and positive photoresist, the latter both before and after ion-implantation
Keywords
carbon compounds; environmental factors; integrated circuit manufacture; photoresists; CO2; CO2-based supercritical fluids; IC manufacturing solvents; hard-baked photoresists stripping; integrated circuits production; solvent/treatment system; Carbon dioxide; Chemical hazards; Chemical technology; Integrated circuit technology; Manufacturing; Metallization; Production; Resists; Solvents; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics and the Environment, 1999. ISEE -1999. Proceedings of the 1999 IEEE International Symposium on
Conference_Location
Danvers, MA
Print_ISBN
0-7803-5495-8
Type
conf
DOI
10.1109/ISEE.1999.765840
Filename
765840
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