• DocumentCode
    2816265
  • Title

    Carbon dioxide-based supercritical fluids as IC manufacturing solvents

  • Author

    Rubin, J.B. ; Davenhall, L.B. ; Taylor, C.M.V. ; Sivils, L. Dale ; Pierce, T. ; Tiefert, Karl

  • Author_Institution
    Phys. Org. Chem. Group, Los Alamos Nat. Lab., NM, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    13
  • Lastpage
    20
  • Abstract
    The production of integrated circuits (ICs) involves a number of discrete steps which utilize hazardous or regulated solvents and generate large waste streams. ES&H considerations associated with these chemicals have prompted a search for alternative, more environmentally benign solvent systems. Here, the authors describe how an emerging technology for conventional solvent replacement is the use of supercritical fluids based on carbon dioxide (CO2). Research work, conducted at Los Alamos in conjunction with the Hewlett-Packard Company, has lead to the development of a CO2-based supercritical fluid treatment system for the stripping of hard-baked photoresists. This treatment system, known as supercritical CO2 resist remover, or SCORR, uses a two-component solvent composed of a nonhazardous, nonregulated compound, dissolved in supercritical CO2. The solvent/treatment system has been successfully tested on metallized Si wafers coated with negative and positive photoresist, the latter both before and after ion-implantation
  • Keywords
    carbon compounds; environmental factors; integrated circuit manufacture; photoresists; CO2; CO2-based supercritical fluids; IC manufacturing solvents; hard-baked photoresists stripping; integrated circuits production; solvent/treatment system; Carbon dioxide; Chemical hazards; Chemical technology; Integrated circuit technology; Manufacturing; Metallization; Production; Resists; Solvents; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 1999. ISEE -1999. Proceedings of the 1999 IEEE International Symposium on
  • Conference_Location
    Danvers, MA
  • Print_ISBN
    0-7803-5495-8
  • Type

    conf

  • DOI
    10.1109/ISEE.1999.765840
  • Filename
    765840