Development of new Pb-free solder alloy of Sn-Ag-Bi system

Author

Habu, Kazutaka ; Takeda, Naoko ; Watanabe, Haruo ; Ooki, Hiroshi ; Abe, Jiro ; Saito, Takashi ; Taniguchi, Yoshikuni ; Takayama, Kinjiro

Author_Institution

Res. Center, Sony Corp., Yokohama, Japan

fYear

1999

fDate

1999

Firstpage

21

Lastpage

24

Abstract

New solder alloys are now being developed to find Pb-free alternatives to conventional lead-based solder for environmental reasons. The authors have developed a novel lead-free solder made up of tin, silver, bismuth, copper, and germanium with the composition Sn-2.0Ag-4.0Bi-0.5Cu-0.1Ge. The small amount of germanium drastically improves the solderability and the reliability of the Sn-Ag-Bi system. The new solder is usable in conventional soldering equipment

Keywords

bismuth alloys; copper alloys; environmental factors; germanium alloys; reliability; silver alloys; soldering; tin alloys; SnAgBiCuGe; SnAgBiCuGe Pb-free solder alloy; environmentally-friendly solder; reliability; solderability; Bismuth; Cooling; Copper alloys; Environmentally friendly manufacturing techniques; Germanium alloys; Lead; Pollution measurement; Temperature; Time measurement; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics and the Environment, 1999. ISEE -1999. Proceedings of the 1999 IEEE International Symposium on

Conference_Location

Danvers, MA

Print_ISBN

0-7803-5495-8

Type

conf

DOI

10.1109/ISEE.1999.765841

Filename

765841