DocumentCode
2816693
Title
Durable goods labeling and plastic recycling strategy for the electronics industry (design aspects for a recycling compatible plastic label)
Author
Süoss, Bemardus M J C ; Korfmacher, H.A. ; Jordan, Robert C.
Author_Institution
3M Labs., Germany
fYear
1999
fDate
1999
Firstpage
157
Lastpage
159
Abstract
After a two-year development in cooperation with a major electronics OEM and plastic manufacturer, in 1998 3M introduced a fully recycling compatible label for ABS, PC and HIPS and their blends. This type of product is designed to be recycling compatible and not influence physical and mechanical properties of the recycled feedstock. Tests have been conducted on important plastic parameters like impact strength, MFI and MVI, tensile, elongation and vicat temperature
Keywords
electronics industry; plastics; recycling; 3M; ABS; HIPS; MFI; MVI; PC; durable goods labeling; electronics industry; elongation; impact strength; mechanical properties; physical properties; plastic recycling strategy; recycled feedstock; recycling compatible plastic label; tensile strength; vicat temperature; Consumer electronics; Electronic waste; Electronics industry; Europe; Government; Labeling; Manufacturing processes; Packaging; Plastics; Recycling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics and the Environment, 1999. ISEE -1999. Proceedings of the 1999 IEEE International Symposium on
Conference_Location
Danvers, MA
Print_ISBN
0-7803-5495-8
Type
conf
DOI
10.1109/ISEE.1999.765868
Filename
765868
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