• DocumentCode
    2816796
  • Title

    Separation processes and economic evaluation of tertiary recycling of electronic scrap

  • Author

    Busselle, Lincoln D. ; Moore, Ted A. ; Shoemaker, John M. ; Allred, Ronald E.

  • Author_Institution
    Adherent Technol. Inc., Albuquerque, NM, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    192
  • Lastpage
    197
  • Abstract
    Adherent Technologies´ development of a novel conversion process for the recycling of electronic scrap has led to the investigation of separation technologies for the products produced directly from this process. An economic model of the entire process has also been developed based on the latest findings. This process will handle complex mixtures of plastics, metals, ceramics and fiberglass or reinforcing components such as those that make up electronic scrap without labor-intensive separation before processing. Products from the process include valuable recycled materials: chemicals, metals, ceramics and fiberglass, which have ready available markets. Operation and maintenance of the process requires a minimum labor force. Little or no segregation is required for the feedstock before processing, thus reducing labor costs and dramatically increasing the economics of the process over existing recycling techniques. This process provides an economical and environmentally conscious solution to the problem of electronic scrap today and in the future
  • Keywords
    economics; electronics industry; recycling; separation; Adherent Technologies; economic evaluation; electronic scrap; recycled materials; separation processes; tertiary recycling; Ceramics; Chemical processes; Chemical products; Consumer electronics; Costs; Environmental economics; Inorganic materials; Plastics; Recycling; Separation processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 1999. ISEE -1999. Proceedings of the 1999 IEEE International Symposium on
  • Conference_Location
    Danvers, MA
  • Print_ISBN
    0-7803-5495-8
  • Type

    conf

  • DOI
    10.1109/ISEE.1999.765874
  • Filename
    765874