Title :
Scavenging thermal-noise energy for implementing long-term self-powered CMOS timers
Author :
Liang Zhou ; Sarkar, Pradyut ; Chakrabartty, Shantanu
Author_Institution :
Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
Abstract :
One of the major challenges in remotely powered sensors is that events being monitored can not be time-stamped due to the unavailability of a continuously active timer or system clock. Implementing such a timer would require access to a perennial source of energy, which for a structural health monitoring (SHM) application, could easily span several years. In this paper, we present a novel approach to implement self-powered timers that only requires presence of ambient thermal energy. The operational principle of the timer is based on the physics of trap-assisted electron transportation in floating-gate capacitors which yields leakage currents down to 10-21A. Using a differential architecture the proposed timer compensates for the effects of temperature variations during the timer read-out. In this paper we validate the proof-of-concept using measurement results obtained from different timer topologies which have been prototyped in a 0.5μm CMOS process.
Keywords :
CMOS digital integrated circuits; CMOS integrated circuits; capacitors; condition monitoring; leakage currents; semiconductor device noise; thermal noise; timing circuits; CMOS process; SHM application; ambient thermal energy; continuously active timer; differential architecture; floating-gate capacitors; leakage currents; perennial energy source; proof-of-concept; remotely powered sensors; self-powered CMOS timers; size 0.5 mum; structural health monitoring application; system clock; temperature variations; thermal-noise energy scavenging; timer read-out; timer topologies; trap-assisted electron transportation; Current measurement; Electron traps; Leakage currents; Metals; Sensors; Temperature measurement; Voltage measurement;
Conference_Titel :
Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4673-5760-9
DOI :
10.1109/ISCAS.2013.6572313