Title :
Cooling techniques in electronics
Author_Institution :
Redpoint Ltd., Swindon, UK
Abstract :
There are only three main tools in thermal management: conduction, convection and radiation. The relative importance of each, and the way in which each mechanism is employed varies considerably depending on which level of the electronic system is under consideration. Bearing this in mind, the author discusses the following: passive and active cooling of chips; surface mount assemblies; active cooling of packages and PCBs; and enclosure cooling
Keywords :
cooling; integrated circuit technology; packaging; printed circuits; surface mount technology; PCB cooling; active cooling; chip cooling; electronic system; enclosure cooling; packages; passive cooling; surface mount assemblies; thermal management;
Conference_Titel :
Thermal Design of Electronic Systems, IEE Colloquium on
Conference_Location :
London
