Title :
IEE Colloquium on `Thermal Design of Electronic Systems´ (Digest No.49)
Abstract :
The following topics were dealt with: heat transfer fundamentals; electro-thermal simulation of hybrid and VLSI circuits; reliability implications of component temperature in electronic systems; thermal analysis using finite difference techniques; cooling techniques in electronics; and thermal design in aerospace systems
Keywords :
cooling; heat transfer; integrated circuit technology; packaging; printed circuits; thermal analysis; VLSI circuits; aerospace systems; component temperature; cooling techniques; electro-thermal simulation; electronic systems; electrothermal simulation; heat transfer; hybrid IC; packaging; reliability; thermal analysis; thermal design;
Conference_Titel :
Thermal Design of Electronic Systems, IEE Colloquium on
Conference_Location :
London
