DocumentCode :
2817742
Title :
Comparison of TID Response of Micron Technology Single-Level Cell High Density NAND Flash Memories
Author :
Nguyen, Duc N. ; Irom, Farokh
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
fYear :
2010
fDate :
20-23 July 2010
Firstpage :
4
Lastpage :
4
Abstract :
Total ionizing dose (TID) response for Micron Technology single-level cell (SLC) 1 Gb, 2 Gb, 4 Gb and 8 Gb NAND flash memories are reported. Scaling effects in TID response is discussed. Floating gates bit error scales with feature size. Also, charge pump TID degradation and standby current improves with scaling.
Keywords :
NAND circuits; flash memories; radiation effects; Micron Technology single-level cell; TID; floating gates bit error scale; high density NAND flash memories; scaling effect; total ionizing dose; Charge pumps; Computer architecture; Current measurement; Flash memory; Microprocessors; Nonvolatile memory; Radiation effects;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radiation Effects Data Workshop (REDW), 2010 IEEE
Conference_Location :
Denver, CO
ISSN :
2154-0519
Print_ISBN :
978-1-4244-8405-8
Type :
conf
DOI :
10.1109/REDW.2010.5619508
Filename :
5619508
Link To Document :
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