DocumentCode
2818083
Title
Three-Dimensional Simulation of Stress Dependent Thermal Oxidation
Author
Hollauer, Ch. ; Ceric, H. ; Selberherr, S.
Author_Institution
Institute for Microelectronics, TU Vienna, Gußhausstraße 27-29/E360, 1040 Wien, Austria. Phone: +43-1-58801/36036, Fax: +43-1-58801/36099, E-mail: hollauer@iue.tuwien.ac.at
fYear
2005
fDate
01-03 Sept. 2005
Firstpage
183
Lastpage
186
Abstract
We present a sophisticated numerical model for the simulation of thermal oxidation on complex three-dimensional structures. This comprehensive oxidation model takes into account that the diffusion of oxidants, the chemical reaction, and the volume increase occur simultaneously in a so-called reactive layer which has a spatial finite width, in contrast to the sharp interface between silicon and dioxide in the conventional formulation. Our oxidation model also includes the coupled stress dependence of the oxidation process, because the influence of stress is shown to be considerable.
Keywords
Atmosphere; Atmospheric modeling; Chemical processes; Electronic mail; Microelectronics; Numerical models; Oxidation; Silicon; Temperature dependence; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 2005. SISPAD 2005. International Conference on
Print_ISBN
4-9902762-0-5
Type
conf
DOI
10.1109/SISPAD.2005.201503
Filename
1562055
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