• DocumentCode
    2818083
  • Title

    Three-Dimensional Simulation of Stress Dependent Thermal Oxidation

  • Author

    Hollauer, Ch. ; Ceric, H. ; Selberherr, S.

  • Author_Institution
    Institute for Microelectronics, TU Vienna, Gußhausstraße 27-29/E360, 1040 Wien, Austria. Phone: +43-1-58801/36036, Fax: +43-1-58801/36099, E-mail: hollauer@iue.tuwien.ac.at
  • fYear
    2005
  • fDate
    01-03 Sept. 2005
  • Firstpage
    183
  • Lastpage
    186
  • Abstract
    We present a sophisticated numerical model for the simulation of thermal oxidation on complex three-dimensional structures. This comprehensive oxidation model takes into account that the diffusion of oxidants, the chemical reaction, and the volume increase occur simultaneously in a so-called reactive layer which has a spatial finite width, in contrast to the sharp interface between silicon and dioxide in the conventional formulation. Our oxidation model also includes the coupled stress dependence of the oxidation process, because the influence of stress is shown to be considerable.
  • Keywords
    Atmosphere; Atmospheric modeling; Chemical processes; Electronic mail; Microelectronics; Numerical models; Oxidation; Silicon; Temperature dependence; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2005. SISPAD 2005. International Conference on
  • Print_ISBN
    4-9902762-0-5
  • Type

    conf

  • DOI
    10.1109/SISPAD.2005.201503
  • Filename
    1562055