DocumentCode :
2818083
Title :
Three-Dimensional Simulation of Stress Dependent Thermal Oxidation
Author :
Hollauer, Ch. ; Ceric, H. ; Selberherr, S.
Author_Institution :
Institute for Microelectronics, TU Vienna, Gußhausstraße 27-29/E360, 1040 Wien, Austria. Phone: +43-1-58801/36036, Fax: +43-1-58801/36099, E-mail: hollauer@iue.tuwien.ac.at
fYear :
2005
fDate :
01-03 Sept. 2005
Firstpage :
183
Lastpage :
186
Abstract :
We present a sophisticated numerical model for the simulation of thermal oxidation on complex three-dimensional structures. This comprehensive oxidation model takes into account that the diffusion of oxidants, the chemical reaction, and the volume increase occur simultaneously in a so-called reactive layer which has a spatial finite width, in contrast to the sharp interface between silicon and dioxide in the conventional formulation. Our oxidation model also includes the coupled stress dependence of the oxidation process, because the influence of stress is shown to be considerable.
Keywords :
Atmosphere; Atmospheric modeling; Chemical processes; Electronic mail; Microelectronics; Numerical models; Oxidation; Silicon; Temperature dependence; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2005. SISPAD 2005. International Conference on
Print_ISBN :
4-9902762-0-5
Type :
conf
DOI :
10.1109/SISPAD.2005.201503
Filename :
1562055
Link To Document :
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