DocumentCode :
2820032
Title :
Recent Advances in GaN Power Switching Devices
Author :
Tamura, Satoshi ; Anda, Yoshiharu ; Ishida, Masahiro ; Uemoto, Yasuhiro ; Ueda, Tetsuzo ; Tanaka, Tsuyoshi ; Ueda, Daisuke
Author_Institution :
Semicond. Device Res. Center, Panasonic Corp., Nagaokakyo, Japan
fYear :
2010
fDate :
3-6 Oct. 2010
Firstpage :
1
Lastpage :
4
Abstract :
Recent advances in GaN power switching devices are reviewed. A new normal-off GaN transistor called Gate Injection Transistor (GIT) increases drain current by conductivity modulation. The GIT is fabricated on cost-effective Si substrates by novel MOCVD technology enabling crack-free and smooth surfaces over 6-inch wafer. These technologies with thermally stable device isolation by Fe ion implantation are applied for a monolithic inverter IC. This is the world fist demonstration of a GaN inverter IC for motor drive, which reduces the total operating loss by 42% from that by the IGBT-based inverter. These technologies are indispensable for wide-spread use of GaN power switching transistors in the future.
Keywords :
insulated gate bipolar transistors; ion implantation; monolithic integrated circuits; power integrated circuits; Fe; GaN; IGBT-based inverter; MOCVD technology; conductivity modulation; crack-free surface; drain current; gate injection transistor; ion implantation; monolithic inverter IC; motor drive; power switching device; power switching transistor; smooth surface; thermally stable device isolation; Gallium nitride; Integrated circuits; Inverters; Logic gates; Silicon; Substrates; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Compound Semiconductor Integrated Circuit Symposium (CSICS), 2010 IEEE
Conference_Location :
Monterey, CA
ISSN :
1550-8781
Print_ISBN :
978-1-4244-7437-0
Electronic_ISBN :
1550-8781
Type :
conf
DOI :
10.1109/CSICS.2010.5619659
Filename :
5619659
Link To Document :
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