DocumentCode
2820446
Title
Breakdown voltage behavior of PET thermoplastics at DC and AC voltages
Author
Grzybowski, S. ; Feilat, E.A. ; Knight, P. ; Doriott, L.
Author_Institution
Dept. of Electr. & Comput. Eng., Mississippi State Univ., MS, USA
fYear
1999
fDate
1999
Firstpage
284
Lastpage
287
Abstract
The demand on thermoplastic encapsulation of coils and electronic devices has been increased recently as an alternative to thermosets for electrical insulation, heat dissipation and physical protection of the encapsulated devices from harsh environmental operating conditions. Compared with thermosets, thermoplastics offer excellent electrical properties, superior surface hardness, excellent dimensional stability and good chemical and heat resistance. This paper presents a Weibull statistical analysis of breakdown voltages of PET thermoplastics polyester cups used for encapsulating high voltage coils. The behavior of the polyester cups at DC and AC voltages and under dry and wet conditions is demonstrated. It was found in this work that the DC breakdown voltage of the polyester cups are much higher than the AC breakdown voltage under dry conditions. On the other hand, under wet conditions the DC breakdown voltage significantly decreased in comparison with the AC breakdown voltage. Moreover, it was found that the DC breakdown voltages are widely scattered in comparison with the AC breakdown voltages. It was also found that the statistical behavior of the DC breakdown voltages under wet conditions follow a mixed Weibull distribution. It is believed that this behavior is attributed to the presence of technical defects in some cups such as microvoids
Keywords
Weibull distribution; coils; electric breakdown; encapsulation; insulator testing; moisture; plastics; polymer insulators; statistical analysis; AC voltages; DC voltages; HV coils; PET thermoplastics; Weibull statistical analysis; breakdown voltage behavior; dry conditions; electrical insulation; encapsulated devices; harsh environmental operating conditions; heat dissipation; high voltage coils; microvoids; mixed Weibull distribution; physical protection; polyester cups; polyethylene terephthalate; technical defects; thermoplastic encapsulation; wet conditions; Chemicals; Coils; Dielectrics and electrical insulation; Electric resistance; Encapsulation; Positron emission tomography; Protection; Resistance heating; Surface resistance; Thermal stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Southeastcon '99. Proceedings. IEEE
Conference_Location
Lexington, KY
Print_ISBN
0-7803-5237-8
Type
conf
DOI
10.1109/SECON.1999.766141
Filename
766141
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