Title :
A loading effect insensitive and high precision clock synchronization circuit
Author :
Hong, Kai-Wei ; Cheng, Kuo-Hsing ; Chen, Chi-Hsiang ; Liu, Jen-Chieh ; Chen, Chien-Cheng
Author_Institution :
Dept. of Electr. Eng., Nat. Central Univ., Jhongli, Taiwan
Abstract :
This study proposes a output loading effect insensitive and high precision clock synchronization (HPCS) circuit which can accept variable duty cycle clock signal. This HPCS is capable of synchronizing the external clock and the internal clock in 3 clock cycles. By using three innovative techniques, the proposed HPCS can also reduce the clock skew between the external clock and the internal clock in a chip. First, by modifying the mirror control circuit, the HPCS operates correctly with an arbitrary duty cycle (25% ~ 75%) clock signal. Second, the HPCS works precisely and ignores the effect of output load changes by moving the measurement delay line beyond the output driver. Finally, the HPCS can enhance the resolution between the external clock and internal clock with a fine tuning structure. After phase locking, the maximum static phase error is less than 20 ps. The proposed chip is fabricated in a TSMC 130 nm CMOS process, and has an operating frequency range from 300 MHz to 600 MHz. At 600 MHz, the power consumption and rms jitter are 2.4 mW and 3.06 ps, respectively. The active area of this chip is 0.3×0.13 mm2.
Keywords :
CMOS integrated circuits; clocks; delay circuits; synchronisation; HPCS circuit; TSMC CMOS process; clock cycle; clock skew; duty cycle clock signal; external clock; frequency 300 MHz to 600 MHz; high precision clock synchronization circuit; internal clock; measurement delay line; mirror control circuit; output driver; output loading effect insensitive circuit; phase locking; power 2.4 mW; size 130 nm; static phase error; Clocks; Delay; Loading; Mirrors; Synchronization; Tuning; High precision; synchronization circuit and synchronous mirror delay (SMD); variable duty cycle;
Conference_Titel :
ESSCIRC, 2010 Proceedings of the
Conference_Location :
Seville
Print_ISBN :
978-1-4244-6662-7
DOI :
10.1109/ESSCIRC.2010.5619756