DocumentCode
2821958
Title
Design, Test, Integration and Packaging of MEMS/MOEMS 2003 (IEEE Cat. No.03EX713)
fYear
2003
fDate
7-7 May 2003
Abstract
The following topics were dealt with: MEMS design and testing; mixed systems modelling; process simulation, test and fault analysis; MEMS modelling and simulation methodology; MEMS microfabrication, MEMS packaging; integrated processes and assembly for MEMS/MOEMS manufacturing; failure analysis and reliability.
Keywords
electronics packaging; failure analysis; micro-optics; micromachining; micromechanical devices; reliability; MEMS design; MEMS microfabrication; MEMS modelling; MOEMS; MOEMS design; device testing; failure analysis; fault analysis; integrated processes; microassembly; mixed systems modelling; packaging; process simulation; reliability; simulation methodology; IEEE catalog; IEEE services; Laboratories; Libraries; Micromechanical devices; Packaging; Permission; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on
Conference_Location
Cannes
Print_ISBN
0-7803-7066-X
Type
conf
DOI
10.1109/DTIP.2003.1286995
Filename
1286995
Link To Document