Title :
Design, Test, Integration and Packaging of MEMS/MOEMS 2003 (IEEE Cat. No.03EX713)
Abstract :
The following topics were dealt with: MEMS design and testing; mixed systems modelling; process simulation, test and fault analysis; MEMS modelling and simulation methodology; MEMS microfabrication, MEMS packaging; integrated processes and assembly for MEMS/MOEMS manufacturing; failure analysis and reliability.
Keywords :
electronics packaging; failure analysis; micro-optics; micromachining; micromechanical devices; reliability; MEMS design; MEMS microfabrication; MEMS modelling; MOEMS; MOEMS design; device testing; failure analysis; fault analysis; integrated processes; microassembly; mixed systems modelling; packaging; process simulation; reliability; simulation methodology; IEEE catalog; IEEE services; Laboratories; Libraries; Micromechanical devices; Packaging; Permission; Testing;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on
Conference_Location :
Cannes
Print_ISBN :
0-7803-7066-X
DOI :
10.1109/DTIP.2003.1286995
