DocumentCode
2822123
Title
Understanding faulty behavior of a peristaltic micropump
Author
Knight, M. ; Kaminska, Bozena ; House, J.
Author_Institution
Dept. of Electr. & Comput. Eng., Oregon Health & Sci. Univ., Beaverton, OR, USA
fYear
2003
fDate
5-7 May 2003
Firstpage
39
Lastpage
44
Abstract
The effects of process parameters, specifically those related to silicon wet etch and metal deposition, on the performance of the microheaters in a peristaltic microfluidic pump are presented. The thermal resistance of the microheaters is strongly dependent upon the relative thermal isolation, which impacts maximum pumping speed (from a few Hertz to kilo-Hertz). Thermal isolation is shown to not be an issue in the pump design given the spacing of the neighboring microheaters.
Keywords
elemental semiconductors; etching; microactuators; microfluidics; micropumps; silicon; thermal resistance; faulty behavior; metal deposition; microheaters; peristaltic microfluidic pump; peristaltic micropump; relative thermal isolation; silicon wet etch; thermal isolation; thermal resistance; Atomic force microscopy; Biomembranes; Chemical sensors; Etching; Infrared heating; Microfluidics; Micropumps; Silicon; Thermal resistance; Valves;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on
Print_ISBN
0-7803-7066-X
Type
conf
DOI
10.1109/DTIP.2003.1287005
Filename
1287005
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