DocumentCode :
28223
Title :
Current Stability in Multi-Mesa-Channel AlGaN/GaN HEMTs
Author :
Ohi, Kota ; Asubar, Joel Tacla ; Nishiguchi, Kenji ; Hashizume, Takumi
Author_Institution :
Res. Center for Integrated Quantum Electron., Hokkaido Univ., Sapporo, Japan
Volume :
60
Issue :
10
fYear :
2013
fDate :
Oct. 2013
Firstpage :
2997
Lastpage :
3004
Abstract :
We develop and characterize multi-mesa-channel (MMC) AlGaN/GaN high-electron mobility transistors (HEMTs), in which a periodic trench structure is fabricated only under the gate electrode. A surrounding-field effect in the MMC structure results in a shallower threshold voltage and a smaller subthreshold slope than those of the standard planar-type HEMT. In addition, the MMC HEMT shows a low knee voltage and a weak dependence of on-resistance (RON) on the gate-drain distance. Following identical off-state bias stress, the MMC HEMT exhibits low current collapse. The relative decrease in access resistance of the MMC device compared with the planar device can reduce the effects of access resistance on the drain current. It is likely that a high impedance of each nanochannel also contributes to the current stability of the MMC HEMT.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; stability; wide band gap semiconductors; AlGaN-GaN; MMC high-electron mobility transistors; MMC structure; access resistance; current stability; drain current; gate electrode; gate-drain distance; identical off-state bias stress; low current collapse; low knee voltage; multimesa-channel HEMTs; nanochannel; periodic trench structure; planar-type HEMT device; subthreshold slope; surrounding-field effect; threshold voltage; Aluminum gallium nitride; Gallium nitride; HEMTs; Logic gates; MODFETs; Stress; Threshold voltage; Access resistance; GaN; current collapse; high-electron mobility transistor (HEMT); multi-mesa-channel (MMC); off-state stress; subthreshold slope; threshold voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2013.2266663
Filename :
6555829
Link To Document :
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