Title :
Thermal and mechanical simulation of bulk resonators
Author :
Morata, M. ; Figueras, E. ; Gràcia, I. ; Fonseca, L. ; Cané, C.
Author_Institution :
Centro Nacional de Microelectron., Campus Univ. Autonoma de Barcelona, Bellaterra, Spain
Abstract :
In this work, a mechanical silicon resonator fabricated on Silicon On Insulator (SOI) substrates, is simulated using ANSYS. Two different models are used depending on the objectives of the simulation. A 2D model is used for simulating the resonance frequency and the surface temperature distribution, as long as a 3-D model is necessary for more accurate thermal and stress-distribution analysis. Simple structures as cantilevers have been fabricated with different dimensions and preliminary results of the modal behaviour have been performed. As an example, fundamental modes around 3 kHz to 99 kHz and quality factors around 63 up to 1200 have been measured on structures of 1000×1000 μm2 and 300×300 μm2.
Keywords :
Q-factor; elemental semiconductors; micromechanical resonators; silicon-on-insulator; 2D model; 3 to 99 kHz; 3-D model; SOI; Si; bulk resonators; mechanical silicon resonator; mechanical simulation; quality factors; resonance frequency; silicon on insulator; stress distribution analysis; surface temperature distribution; thermal distribution analysis; thermal simulation; Analytical models; Chemical sensors; Force measurement; Frequency; Polymers; Sensor arrays; Shape; Silicon on insulator technology; Temperature sensors; Vibrations;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on
Print_ISBN :
0-7803-7066-X
DOI :
10.1109/DTIP.2003.1287038