DocumentCode
2822864
Title
Wafer-scale 0-level packaging of (RF-)MEMS devices using BCB
Author
Jourdain, Anne ; Ziad, Hocine ; De Moor, Piet ; Tilmans, Harrie A C
Author_Institution
IMEC, Leuven, Belgium
fYear
2003
fDate
5-7 May 2003
Firstpage
239
Lastpage
244
Abstract
This paper describes a wafer-to-wafer 0-level packaging method to realize low-profile, near hermetically sealed packaged devices using BenzoCycloButene (BCB) as the bonding and sealing material. The technique is fully described, and the bond is mechanically tested in terms of shear strength and hermeticity. Silicon caps as thin as 100 μm have been successfully bonded to silicon device wafers. Shear strength as high as 20 MPA have been measured, and all tested packaged devices were gross leak tight.
Keywords
bonding processes; elemental semiconductors; micromechanical devices; semiconductor device packaging; shear strength; silicon; wafer-scale integration; 100 micron; BenzoCycloButene; MEMS devices; Si; bonding; hermeticity; packaging; sealing material; shear strength; silicon caps; Assembly; Costs; Microelectromechanical devices; Micromechanical devices; Packaging machines; Sealing materials; Temperature; Testing; Wafer bonding; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on
Print_ISBN
0-7803-7066-X
Type
conf
DOI
10.1109/DTIP.2003.1287044
Filename
1287044
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