DocumentCode :
2822960
Title :
Bonding of polymer microstructures by UV irradiation and welding at low temperatures
Author :
Truckenmüller, R. ; Henzi, P. ; Herrmann, D. ; Saile, V. ; Schomburg, W.K.
Author_Institution :
Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany
fYear :
2003
fDate :
5-7 May 2003
Firstpage :
265
Lastpage :
267
Abstract :
A new bonding process has been developed for polymer microstructures, especially of Polymethylmethacrylate (PMMA), which avoids the problems caused by using adhesives or solvents or applying high temperatures. It is based on photo degradation of polymers. Moulded PMMA microchannels and microspectrometer gratings were covered with PMMA plates by ultraviolet irradiation of the joining faces and subsequent welding at low temperatures. Because of the low thermal load, structure details even in the submicrometer range remain dimensionally stable during the bonding process.
Keywords :
bonding processes; diffraction gratings; microchannel plates; optical polymers; polymer structure; ultraviolet radiation effects; welding; PMMA microchannels; PMMA plates; UV irradiation; bonding processes; microspectrometer gratings; photo degradation; polymer microstructure; polymers photo degradation; polymethylmethacrylate; ultraviolet irradiation; welding; Bonding processes; Gratings; Microchannel; Microstructure; Polymers; Solvents; Temperature; Thermal degradation; Thermal loading; Welding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on
Print_ISBN :
0-7803-7066-X
Type :
conf
DOI :
10.1109/DTIP.2003.1287049
Filename :
1287049
Link To Document :
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