• DocumentCode
    2823045
  • Title

    A novel self-sensitive SFM for nondestructive measurement of tiny vertical surfaces with restricted access

  • Author

    Kobayashi, T. ; Shan, X.C. ; Murakoshi, Y. ; Maeda, Ryutaro

  • Author_Institution
    Nat. Inst. of Adv. Ind. Sci. & Technol., Japan
  • fYear
    2003
  • fDate
    5-7 May 2003
  • Firstpage
    286
  • Lastpage
    289
  • Abstract
    This paper presents a novel scanning force microscope (SFM) for the nondestructive measurement of tiny micromachined vertical surfaces, which conventional SFMs or other instruments cannot access without destruction. In addition to its access flexibility, our SFM uses the self-sensitive cantilever for sensing its own deflections. As a result, it can access tiny areas and restricted locations for measuring the features of microstructures; for example, the surfaces of a tiny vertical reflecting mirror, the inside walls of a small hole and the inner surfaces of a micro mold insert. The SFM has been successfully used in evaluating the vertical reflecting surfaces of silicon mirrors, the side walls of cavities in a micro mold and the vertical reflecting surfaces of embossed polymer mirrors with a dimension of 500 μm long×100 μm wide×200 μm deep (high). In this paper, details of the design and instrumentation of our SFM, and how it is used for monitoring the process for fabricating a polymer-based optical switch will be presented.
  • Keywords
    atomic force microscopy; micromachining; microsensors; microswitches; monitoring; nondestructive testing; optical switches; micro mold insert; micromachined vertical surface; microstructure; monitoring; nondestructive measurement; polymer mirrors; polymer-based optical switch; scanning force microscopy; self-sensitive cantilever; sensing; silicon mirrors; Area measurement; Force measurement; Instruments; Microscopy; Microstructure; Mirrors; Monitoring; Optical design; Polymers; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on
  • Print_ISBN
    0-7803-7066-X
  • Type

    conf

  • DOI
    10.1109/DTIP.2003.1287054
  • Filename
    1287054