Title :
Mechanical qualification of RF-filters for space applications
Author :
Lafontan, Xavier ; Kuchenbecke, Jessica ; Guillon, Bertrand ; Pons, Patrick ; Nerin, Philipge ; Pressecq, Francis ; Dardalhon, Muriel ; Rigo, Sébastien
Author_Institution :
MEMSCAP, Crolles, France
Abstract :
Micromachined RF-filters for Millimeter wave communications are expected to replace the actual bulky off-chip filters since they offer high performances at low cost. Nevertheless, their large aspect ratio between area (several mm2) and their thickness (a few microns) may make them sensitive to mechanical stress such as vibrations or shocks. In this paper, we focus on their mechanical characteristics. The studied filters are built on a thin SiO2/SixNy dielectric membrane and the signal lines are in gold. This composition of material makes the analytical approach rapidly complex. So, in counterparts, we ran FEM simulations to study the influence of process parameters such as stress on flexion modes. Then, we measured by vibrometry the natural resonant frequency of several filter sizes (from 1 mm2 up to 70 mm2) and compared results with previous simulations. Finally, we applied at die level, standard procedures of shock and vibration used for space qualification. All the membranes withstood the tests without structural damage.
Keywords :
dielectric thin films; finite element analysis; membranes; micromechanical devices; radiofrequency filters; silicon compounds; FEM simulations; SiO2-SiN; actual bulky off-chip filters; analytical approach; aspect ratio; die level; flexion modes; gold; mechanical characteristics; mechanical stress; micromachined RF filters; resonant frequency; shocks; space applications; structural damage; thin SiO2-SixNy dielectric membrane; vibrations; vibrometry; Biomembranes; Costs; Dielectrics; Electric shock; Filters; Gold; Millimeter wave communication; Qualifications; Stress; Vibrations;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on
Print_ISBN :
0-7803-7066-X
DOI :
10.1109/DTIP.2003.1287064