DocumentCode
2823214
Title
Large full-well capacity stitched CMOS image sensor for high temperature applications
Author
Durini, Daniel ; Matheis, Frank ; Nitta, Christian ; Brockherde, Werner ; Hosticka, Bedrich J.
Author_Institution
Fraunhofer Inst. for Microelectron. Circuits & Syst. (IMS), Duisburg, Germany
fYear
2010
fDate
14-16 Sept. 2010
Firstpage
130
Lastpage
133
Abstract
A novel CMOS pixel architecture is presented, which fulfills the need for acquisition of very high photon fluxes at high temperatures. A buried photodiode based pixel structure was analysed in detail, and then applied to fabricate the 256 × 256 large area imager sensor in a standard 0.5μm CMOS process using mask reticle stitching.
Keywords
CMOS image sensors; photodiodes; reticles; CMOS pixel architecture; buried photodiode; full-well capacity stitched CMOS image sensor; high temperature applications; mask reticle stitching; pixel structure; size 0.5 mum; Computer architecture; Dark current; Noise; Photodiodes; Pixel; Temperature measurement; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
ESSCIRC, 2010 Proceedings of the
Conference_Location
Seville
ISSN
1930-8833
Print_ISBN
978-1-4244-6662-7
Type
conf
DOI
10.1109/ESSCIRC.2010.5619823
Filename
5619823
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