DocumentCode
2823254
Title
Hexagonal microlens array fabricated by proximity printing via UV lithography
Author
Yang, Hsihamg ; Lin, Che-Ping ; Chao, Ching-Kong ; Pan, Cheng-Tang
Author_Institution
Inst. of Precision Eng., Nat. Chung-Hsing Univ., Taichung, Taiwan
fYear
2003
fDate
5-7 May 2003
Firstpage
356
Lastpage
361
Abstract
This paper presents a new method to fabricate hexagonal microlens array in photoresist by controlling the printing gap in the UV lithography process. This method can precisely control the geometric profile of hexagonal microlens array in the fabrication process without thermal reflow. The proximity printing bends the UV light away from the aperture edges and produces certain exposure in the photoresist outside the aperture edges due to diffraction effects. It causes the photoresist bottom on two adjacent patterns to link each other after development. The fabricated hexagonal microlens diameter has the same size of the pitch distance between two apertures. For example, the aperture pitch distance 120 μm will generate microlens with diameter 120 μm. As found the proximity gap between the mask and photoresist should be twice or more than the aperture pitch distance, the microlens array in photoresist can be generated properly. The experimental results showed that microlens arrays in photoresist were automatically formed without using the thermal reflow process at the printing gap ranged from 240 im to 840 im. Hemispherical microlens array with diameter 120 μm and various geometric profiles can be fabricated in this method.
Keywords
diffraction; masks; microlenses; optical arrays; optical fabrication; photoresists; ultraviolet lithography; 120 micron; UV light; UV lithography; aperture; diffraction effects; geometric profile; hemispherical microlens array; hexagonal microlens array; mask; photoresist; proximity printing gap; Apertures; Lenses; Lithography; Microoptics; Optical device fabrication; Optical devices; Optical refraction; Optical sensors; Printing; Resists;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on
Print_ISBN
0-7803-7066-X
Type
conf
DOI
10.1109/DTIP.2003.1287068
Filename
1287068
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