DocumentCode :
2823348
Title :
Analysis of failure modes and mechanisms in thermally actuated micromachined relays for harsh environments space applications
Author :
Teverovsky, Alexander ; Sharma, Ashok
Author_Institution :
QSS Group Inc., Lanham, MD, USA
fYear :
2003
fDate :
5-7 May 2003
Firstpage :
387
Lastpage :
393
Abstract :
This paper reports test results on electrical characteristics, evaluation of design, failure modes, and reliability of thermally actuated, commercially available micromachined relays. The selected parts have been characterized over a wide range of temperatures (from -100°C to +180°C) and varying load conditions (voltages from 10 V to 70 V, and currents from 5 mA to 200 mA). Mechanical integrity of the parts was evaluated by subjecting them to multiple mechanical shocks in the range from 100 G to 1000 G acceleration with up to 10,000 shocks. Operational life testing was performed at different contact voltages and current loads during 108 switching cycles. All components intended for space applications have to operate in vacuum conditions. To simulate space operation conditions, operational characteristics of the parts were monitored during vacuum testing. Typical failure modes associated with different test conditions are discussed in this paper.
Keywords :
failure analysis; microrelays; reliability; 10 to 70 V; 5 to 200 mA; failure analysis; harsh environments space applications; mechanical integrity; multiple mechanical shocks; reliability; thermally actuated micromachined relays; vacuum testing; Acceleration; Condition monitoring; Electric shock; Electric variables; Failure analysis; Life testing; Performance evaluation; Relays; Temperature distribution; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on
Print_ISBN :
0-7803-7066-X
Type :
conf
DOI :
10.1109/DTIP.2003.1287074
Filename :
1287074
Link To Document :
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