Title :
Yield strength of thin-film parylene-c
Author :
Shih, Victor Chi-Yuan ; Harder, Theodore A. ; Tai, Yu-Chong
Author_Institution :
Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
Abstract :
For the first time, the yield strength of thin-film parylene-c is measured from membrane load-deflection experiments and surface profile analysis. To do so, the onset pressure which causes plastic deformation of the membrane is first experimentally measured. Then a new 2-step displacement model, together with the energy minimization technique, is developed to convert the onset pressure to the yield strength on the pre-stressed parylene membrane under a uniform pressure loading. The results depict a Yield Strength of 59 MPa (or 0.012 of strain) for thin-film parylene-c in comparison to 55 MPa reported by parylene vendor (measured from large samples). To double check with the result, the balloon model is further used to compare with the stress value from our model at the center of parylene membranes and good agreements are obtained.
Keywords :
Young´s modulus; micromechanical devices; plastic deformation; polymer films; yield strength; 2-step displacement model; balloon model; energy minimization technique; membrane load deflection experiments; parylene membranes; parylene vendor; plastic deformation; pressure loading; prestressed parylene membrane; surface profile analysis; thin film parylene-c; yield strength; Biomembranes; Etching; Fabrication; Gold; Plastic films; Pressure measurement; Silicon; Thermal stresses; Transistors; Valves;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on
Print_ISBN :
0-7803-7066-X
DOI :
10.1109/DTIP.2003.1287075