DocumentCode
2823360
Title
Yield strength of thin-film parylene-c
Author
Shih, Victor Chi-Yuan ; Harder, Theodore A. ; Tai, Yu-Chong
Author_Institution
Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
fYear
2003
fDate
5-7 May 2003
Firstpage
394
Lastpage
398
Abstract
For the first time, the yield strength of thin-film parylene-c is measured from membrane load-deflection experiments and surface profile analysis. To do so, the onset pressure which causes plastic deformation of the membrane is first experimentally measured. Then a new 2-step displacement model, together with the energy minimization technique, is developed to convert the onset pressure to the yield strength on the pre-stressed parylene membrane under a uniform pressure loading. The results depict a Yield Strength of 59 MPa (or 0.012 of strain) for thin-film parylene-c in comparison to 55 MPa reported by parylene vendor (measured from large samples). To double check with the result, the balloon model is further used to compare with the stress value from our model at the center of parylene membranes and good agreements are obtained.
Keywords
Young´s modulus; micromechanical devices; plastic deformation; polymer films; yield strength; 2-step displacement model; balloon model; energy minimization technique; membrane load deflection experiments; parylene membranes; parylene vendor; plastic deformation; pressure loading; prestressed parylene membrane; surface profile analysis; thin film parylene-c; yield strength; Biomembranes; Etching; Fabrication; Gold; Plastic films; Pressure measurement; Silicon; Thermal stresses; Transistors; Valves;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on
Print_ISBN
0-7803-7066-X
Type
conf
DOI
10.1109/DTIP.2003.1287075
Filename
1287075
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