• DocumentCode
    2823429
  • Title

    The impact of inter-/intra-functional technological learning on new product development outcomes

  • Author

    Ignatius, J. ; Jantan, M. ; Ramayah, T.

  • Author_Institution
    Dept. of Oper. Manage., Univ. Sains Malaysia, Malaysia
  • Volume
    3
  • fYear
    2004
  • fDate
    18-21 Oct. 2004
  • Firstpage
    1023
  • Abstract
    This research is part of a larger study of 105 project teams from 9 electrical and electronics´ multinational companies in Malaysia. It assesses the extent and effectiveness of inter-/intra-functional technological learning (i.e. comprising knowledge acquisition, information distribution, information interpretation and organizational memory) that occurs within and between new product development project teams/functional groups. Additionally, it investigates the impact of the above four processes on the new product development outcomes (i.e. project success, development speed and product entry timeliness). With the exception of organizational memory, knowledge acquisition, information distribution and information interpretation jointly exert positive influence on project success. Knowledge acquisition and information distribution were found to significantly impact development speed, unlike information interpretation and organizational memory. Knowledge acquisition had a positive impact on product entry timeliness.
  • Keywords
    knowledge acquisition; organisational aspects; product development; information distribution; information interpretation; interfunctional learning; intrafunctional technological learning; knowledge acquisition; multinational companies; organizational memory; product development outcomes; Collaboration; Humans; Knowledge acquisition; Manufacturing industries; Process design; Product development; Production; Project management; Research and development management; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering Management Conference, 2004. Proceedings. 2004 IEEE International
  • Print_ISBN
    0-7803-8519-5
  • Type

    conf

  • DOI
    10.1109/IEMC.2004.1408846
  • Filename
    1408846