DocumentCode
2823897
Title
Building empirical model through simulation - a case study
Author
Tan, C.M. ; Can, Z.H.
Author_Institution
Sch. of EEE, Nanyang Technol. Univ., Singapore
Volume
3
fYear
2004
fDate
18-21 Oct. 2004
Firstpage
1090
Abstract
Simulation and design of experiment are commonly used in engineering design and optimization today. In this work, we apply the methodology of the design of experiment and response surface method to finite element analysis for the building of an empirical model. This eliminates the need for expensive resources to carry out the actual experiments. The developed empirical model enables us to obtain global optimization of a design. To further reduce the resources needed for the development of the model, Draper-Lin small-composite design is used, as it requires the minimum number of "experimental run". However, the design produces an accurate model. We present a modification method to improve the model developed, making it accurate for the optimization of our device design.
Keywords
design engineering; design of experiments; finite element analysis; integrated circuit manufacture; optimisation; response surface methodology; empirical model optimization; engineering design; experiment design; finite element analysis; response surface method; Buildings; Computer aided software engineering; Design optimization; Finite element methods; Integrated circuit modeling; Residual stresses; Response surface methodology; Silicon on insulator technology; Temperature; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering Management Conference, 2004. Proceedings. 2004 IEEE International
Print_ISBN
0-7803-8519-5
Type
conf
DOI
10.1109/IEMC.2004.1408860
Filename
1408860
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