• DocumentCode
    2823897
  • Title

    Building empirical model through simulation - a case study

  • Author

    Tan, C.M. ; Can, Z.H.

  • Author_Institution
    Sch. of EEE, Nanyang Technol. Univ., Singapore
  • Volume
    3
  • fYear
    2004
  • fDate
    18-21 Oct. 2004
  • Firstpage
    1090
  • Abstract
    Simulation and design of experiment are commonly used in engineering design and optimization today. In this work, we apply the methodology of the design of experiment and response surface method to finite element analysis for the building of an empirical model. This eliminates the need for expensive resources to carry out the actual experiments. The developed empirical model enables us to obtain global optimization of a design. To further reduce the resources needed for the development of the model, Draper-Lin small-composite design is used, as it requires the minimum number of "experimental run". However, the design produces an accurate model. We present a modification method to improve the model developed, making it accurate for the optimization of our device design.
  • Keywords
    design engineering; design of experiments; finite element analysis; integrated circuit manufacture; optimisation; response surface methodology; empirical model optimization; engineering design; experiment design; finite element analysis; response surface method; Buildings; Computer aided software engineering; Design optimization; Finite element methods; Integrated circuit modeling; Residual stresses; Response surface methodology; Silicon on insulator technology; Temperature; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering Management Conference, 2004. Proceedings. 2004 IEEE International
  • Print_ISBN
    0-7803-8519-5
  • Type

    conf

  • DOI
    10.1109/IEMC.2004.1408860
  • Filename
    1408860