Abstract :
MCAE can be used throughout the mechanical design of defence electronics. Although traditionally only used for predicting the structural integrity of a unit, a finite element model can be used to encompass the thermal design issues as well. As component miniaturization continues, typical PCB heat dissipations are likely to increase, hence the thermal specification of an LRU will soon overtake its vibration requirements in order of importance. In the future an LRU´s thermal performance is likely to drive the design
