Thermal management of electronics: problems and analytical techniques

An adaptive and hierarchical steady-state, finite-difference technique is employed in a fast-action, thermal-analysis template to model electronic and electrical packages under different thermal loadings (i.e. temperature differences leading to high stresses). These resultant temperature, stress and strain distributions over such packages are presented in 3D colour isometric projections. The high temperature and high thermal stress spots so identified, indicate where further design attention should be devoted, so that longer-life, more-efficient packages may be developed.<>