Thermal management of electronics: problems and analytical techniques

Author

Babus´Haq, R.F. ; George, H.E. ; O´Callaghan, P.W. ; Constant, B.A.

Author_Institution

Dept. of Appl. Energy, Cranfield Inst. of Technol., Bedford, UK

fYear

1989

fDate

15-15 Dec. 1989

Firstpage

42461

Lastpage

410

Abstract

An adaptive and hierarchical steady-state, finite-difference technique is employed in a fast-action, thermal-analysis template to model electronic and electrical packages under different thermal loadings (i.e. temperature differences leading to high stresses). These resultant temperature, stress and strain distributions over such packages are presented in 3D colour isometric projections. The high temperature and high thermal stress spots so identified, indicate where further design attention should be devoted, so that longer-life, more-efficient packages may be developed.<>

Keywords

difference equations; electronic engineering computing; mechanical engineering computing; thermal analysis; thermal stresses; analytical techniques; electrical packages; finite-difference technique; hierarchical steady-state; high stresses; high temperature; high thermal stress spots; isometric projections; strain distributions; temperature differences; thermal loadings; thermal-analysis template; Difference equations; Stress; Thermal factors;

fLanguage

English

Publisher

iet

Conference_Titel

Computer Aided Design Tools for Thermal Management, IEE Colloquium on

Conference_Location

London, UK

Type

conf

Filename

199186