Customised modules-an economic approach

Isolated power semiconductor modules are a familiar part of current system design and manufacture. Historically, customer specific designs have been limited to hybrid technology with relatively low power ratings. Above a few tens of amps modules have been available offering either individual devices or simple circuit functions such as half or full bridges. In general these power modules have been characterised by having a thick copper base for mounting purposes upon which has been fixed an insulator to carry the various semiconductor chips. With the increasing availability of direct copper bonded substrates a new generation of modules has become possible